Heat Sink Calculator

Thermal resistance is the measure of how well a material resists heat flow, measured in °C/W. It's crucial for heat sink design as it determines how effectively heat can be transferred from your component to the environment.

Optimal fin spacing balances convective heat transfer and airflow resistance. Closer fins provide more surface area but restrict airflow, while wider spacing allows better airflow but reduces surface area. Our calculator finds the optimal balance for natural convection.

Yes, thermal interface material (TIM) fills microscopic air gaps between surfaces, significantly improving heat transfer. Common options include thermal pads, thermal paste, and phase change materials with varying thermal conductivities.

Key factors include ambient temperature, power dissipation, heat sink material and surface area, fin geometry, airflow conditions, and thermal interface quality. Surface treatments like anodizing can also improve radiation heat transfer.

This calculator is optimized for natural convection cooling. For forced convection (with fans), heat transfer coefficients are significantly higher, requiring different calculation methods and potentially smaller heat sinks.

Junction temperature is the actual temperature of the semiconductor die inside a component, while case temperature is measured on the component's external package. Junction-to-case thermal resistance accounts for heat transfer through the component itself.

This calculator assumes the heat source covers the entire heat sink base. For concentrated heat sources much smaller than the base, spreading resistance becomes significant and requires more complex analysis.

Aluminum is most common due to cost-effectiveness and good thermal conductivity (200 W/m·K). Copper offers better conductivity (400 W/m·K) but is heavier and more expensive. Surface treatments like anodizing improve emissivity for radiation cooling.